Senior Packaging Engineer

• Lead the development of advanced packaging technologies, including Flip-Chip, Fan-Out, 2.5D/3D, and System-in-Package (SiP) solutions.
• Collaborate closely with design, process, materials, and reliability engineering teams to ensure high-performance, manufacturable packages.
• Drive package technology development from concept through mass production-covering material selection, process integration, and qualification.
• Perform feasibility studies, risk assessments, and provide recommendations for continuous improvement.
• Develop and optimize thermal, mechanical, and electrical models for package performance and reliability.
• Work with suppliers, foundries, and OSATs to ensure manufacturing scalability and seamless integration.
• Conduct failure analysis and drive corrective actions to improve yield and reliability.
• Stay ahead of industry trends and actively contribute to packaging innovation.
• Mentor and provide technical leadership to junior engineers within the team.

• Bachelor's, Master's, or Ph.D. in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
• 5+ years of hands-on experience in semiconductor packaging, including advanced packaging technologies.
• Strong knowledge of package design, material science, and process integration.
• Experience with simulation tools for thermal, mechanical, and electrical modeling.
• Proven success working with OSATs and foundries in packaging development and qualification.
• Excellent problem-solving, communication, and cross-functional collaboration skills.

• Experience with heterogeneous integration, chiplet packaging, or advanced interconnects.
• Familiarity with PCB and substrate design.
• Knowledge of industry standards such as IPC, JEDEC, and SEMI.
• Proficiency in EDA tools like Cadence Allegro, Mentor Graphics, or Synopsys.

microTECH Global